SKU:

EMCP162 186 Downward Pressure Shrapnel To SD Interface Test Socket Burner Programmer
EMCP162 186 下压弹片转SD接口测试座 烧录器 编程器
条码：6922081615685
HSCode：90329000
批量修改原始型号 		采购：Dani  编辑：Shadow  产品经理：Maura


1. Type: test block
2. Interface type: SD
3. Application: integrated circuit IC
4. Test method:
A. Select the limit frame that matches the IC, and place the IC flat in the SOCKET according to the direction
B. Insert the free SD interface according to the direction, connect to the computer or programmer for corresponding testing and burning

Features:
1. The standard SD interface mode is adopted, and the corresponding operations such as testing or burning can be realized by connecting the card reader to the computer or connecting the programmer SD interface
2. Compatible with ball and no ball test, the IC limit frame is formed by a mold, and different size limit frames can be selected according to the IC for replacement, so that different sizes of ICs can be universal
3. Support hot plugging, support for testing through SD interface or through connection with the board on the board corresponding to the PIN
4. The PCB adopts a 4-layer circuit structure to reduce the instability of the product due to signal interference during use. The gold fingers are plated with thick gold to ensure durability and contact.
5. Compatible with both 162-FBGA and 186-FBGA
6. The shrapnel is made of imported beryllium copper by high-precision die stamping, and the head-shaped probe is designed to be hardened and thickened in the later stage to ensure product stability and durability.
7. The connection module adopts an overall structure to reduce the problem of repeated positioning, and ensure that its contact point is accurately aligned with the IC PAD, and the pass rate of one test is high.
8. Adopt through-hole welding structure to ensure good contact, SOCKET and PCBA use positioning holes for precise positioning and easy replacement
9. Adopting flip structure, it is more convenient for manual testing, and the operation is convenient and simple
10. Adopting the integral moulding and spring self-adaptive structure to ensure that ICs of different thicknesses do not need any adjustments to ensure good contact. Test ICs are versatile (the thickness range of 0.6-2.0MM can be tested)
11. The structure adopts injection molding, precise positioning, convenient access to IC, and higher work efficiency

Repair and maintenance:
1. Use an air gun or anti-static brush to remove impurities in the SOCKET seat to make it contact well;
2. Clean the SOCKET with absolute alcohol to clean the attached impurities on the top of the shrapnel and make it contact well;
3. If you find that the shrapnel inside the SOCKET is burned or broken, please purchase the corresponding SOCKET to replace it;
4. The plug in the interface is not detected or cannot be tested, check whether the shrapnel in SOCKET is burned out (if any, please press C to deal with) or there are individual PINs (total 17PIN) that do not pop up naturally (if any, please press C to deal with), check gold Whether the finger is dirty, please wipe the golden finger with an eraser and try again to check whether the card reader or programmer is normal;
5. It is strictly forbidden to soak and clean with organic solvents such as thinner water and board washing water to avoid damage to the internal structure of SOCKET;
6. When not in use for a long time, please seal it with an anti-static bag to prevent dust from falling in and affect the product test performance.



1. 种类：测试座
2. 接口类型：SD
3. 应用范围：集成电路IC
4. 测试方法：
A. 选择和IC匹配的限位框，把IC按方向平放入SOCKET内
B. 按方向插进空闲SD接口，连接电脑或者编程器进行相应的测试、烧录

特点：
1. 采用标准SD接口模式，通过读卡器与电脑连接或通过编程器SD接口连接实现测试或烧录等相应操作
2. 兼容有球无球测试，IC限位框采用模具一体成型，可根据IC选择不同大小限位框进行更换，实现不同大小IC能够通用
3. 支持热拔插，支持通过SD接口或通过连线与板上排针对应PIN相连接进行测试
4. PCB采用4层线路结构，减少产品在使用中因信号干扰引起测试不稳定等现象，金手指镀厚金处理，保证使用的耐用性及接触性
5. 同时兼容162-FBGA 186-FBGA
6. 弹片采用进口铍铜经高精度模具冲压成形，头形仿探针设计，后期加硬、加厚镀金层处理，从而保证产品稳定性及耐用性
7. 连接模块采用整体结构，减少重复定位问题，保证其接触点与IC PAD精准对位，一次测试通过率高
8. 采用通孔焊接结构保证接触良好，SOCKET与PCBA采用定位孔精准定位方便更换
9. 采用翻盖式结构,更加便于手动测试，操作方便简单
10.采用模具整体成型加弹簧自适应结构，保证不同厚度的IC不需要任何调整即可保证其接触良好测试IC通用性广（厚度0.6-2.0MM范围都可测试）
11.结构采用注塑成形,定位精确,取放IC方便，工作效率更高

维修与保养：
1. 用气枪或防静电毛刷把 SOCKET 座里面杂质清除,使其接触良好;
2. 用无水酒精清洗SOCKET，把弹片顶端的附着杂质清洗干净，使其接触良好；
3. 如发现 SOCKET 里面弹片有烧坏或者断裂，请购买相应 SOCKET 更换；
4. 插上接口未检测到或无法进行测试，检查SOCKET里面弹片是否烧坏(如有请按C处理)或者有个别PIN（共17PIN）未自然弹出(如有请按C处理)，检查金手指是否脏污，请用橡皮擦把金手指擦干净再试，检查读卡器或编程器是否正常；
5. 严禁用天那水、洗板水等有机溶剂浸泡、清洗,以免损坏SOCKET 内部结构；
6. 长时间不使用时，请用防静电袋密封保存，避免灰尘落入，影响产品测试性能.


代码：

Specification:
Package weight
One package Weight 0.12kgs / 0.26lb
One Package Size 13.0cm * 10.0cm * 6.0cm / 5.12inch * 3.94inch * 2.36inch
Qty per Carton 242
Carton Weight 30kgs / 66.14lb
Carton Size 50cm * 50cm * 60cm / 19.69inch * 19.69inch * 23.62inch

代码：