1. Mechanic IX 5 Ultra universal breakthrough preheating platform, no air gun, no soldering iron, uniform heating 2. Layering / Tinning / Laminating / Degumming, Compact & Lightweight 3. Uniform heating, no air gun, no solder iron, aluminum alloy panel, freely controlled temperature 4. Fit all sizes of cell phone motherboards, support motherboard delamination, lamination, dot matrix repair 5. Voltage: 110V /220V 6. Support motherboard delamination, lamination, and dot matrix repair 7. Preheating Temperature Range: 20~260 celsius degree 8. Product Size: 8 x 8 x 5.7cm
1.机Mechanic IX 5 Ultra 突破性通用预热平台,无气枪,没有焊接铁,均匀加热 2.分层/镀锡/层压/脱胶,紧凑轻便 3.均匀的加热,没有气枪,没有焊料铁,铝合金面板,自由控制的温度 4.适用于各种尺寸的手机主板,支持主板分层、层压、点阵修复 5.电压:110V/220V 6.支持主板分层、叠片、点阵修复 7.预热温度范围:20?260摄氏度 8.产品尺寸:8 x 8 x 5.7厘米
提交